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Memory modules
Mini eMMC
The innovative eMMC product with smaller size, reduced space occupation, and JEDEC pin definition retains all the performance of standard eMMC, and features high integration and ultimate lightweight.
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Product advantages
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Adopting Mini packaging design, the volume is much smaller than standard eMMC modules, suitable for the needs of miniaturized embedded devices. -
Supports HS400 high-speed mode, with read and write speeds consistent with standard eMMC 5.1 modules. -
Optimized power consumption design, with standby current as low as 100 μ A, extending device battery life. -
Supports BCH/LDPC error correction mode and high erase count. -
Support on-site firmware updates for FFU to adapt to complex working environments. -
The working temperature range is -40 ℃~85 ℃, which can adapt to harsh environments and has stability comparable to standard eMMC modules.
Product Parameters
| Product Name | Product Model | capacity | encapsulation | size | Supported Protocols | Operating Temperature |
| mini eMMC | KS70AAC0 | 64GB | FBGA153 | 7.2*7.2*0.8mm | eMMC 5.1/5.0/4.5 | -25°C~85°C |
| mini eMMC | KS70AAD0 | 128GB | FBGA153 | 7.2*7.2*0.8mm | eMMC 5.1/5.0/4.5 | -25°C~85°C |
Application field
smartwatch
Smart Earphones
Smart Camera
VR equipment
Medical terminal