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Product 
Memory modules
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eMMC 5.1
Combining compatibility and stability, it is widely used in various fields of intelligent hardware devices. High speed performance can effectively improve device data transmission speed, multitasking response, and other capabilities.Self developed firmware and LDPC error correction algorithm, domestic chip production and testing, fully controllable throughout the entire process.
Excellent read and write performance, further reducing energy consumption while ensuring higher efficiency.
Supports HS400 high-speed mode, with excellent random read and write performance, ensuring smooth device operation.
Fully compatible with six major original flash drives, compatible with mainstream SoC platforms, with a platform coverage rate of over 70%.
Supporting firmware upgrades can help improve performance, add functionality, or fix faults.
Relying on the Konsemi supply chain guarantee system, we achieve long-term stable supply and provide rapid response services for bulk orders.
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UFS 2.2
Large capacity, high performance, lower power consumption, supporting new features such as write enhancement, deep sleep, and performance limit notification. The capacity can reach up to 512GB, and it is packaged in FBGA153 with a compact size, suitable for mid to high end mobile terminals and high-end smart devices.Support host performance improvement technology to meet the durability requirements of mobile and portable devices.
Adopting advanced processes and low-power architecture to provide longer battery life for mobile devices.
Support functions such as writing growth technology, deep sleep/performance adjustment notification items, etc.
Built in LDPC 3.0 ECC error correction engine, supporting both hard and soft decoding, with outstanding error correction capabilities.
Provide customized hardware instruction sets and firmware optimization, supporting machine learning and scenario optimization.
The modules have undergone rigorous ATE and system level testing to ensure reliability and compatibility.
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UFS 3.1
Large capacity, high performance, lower power consumption, supporting new features such as write enhancement, deep sleep, and performance limit notification. The capacity can reach up to 512GB, and it is packaged in FBGA153 with a compact size, suitable for mid to high end mobile terminals and high-end smart devices.Support host performance improvement technology to meet the durability requirements of mobile and portable devices.
Adopting advanced processes and low-power architecture to provide longer battery life for mobile devices.
Support functions such as writing growth technology, deep sleep/performance adjustment notification items, etc.
Built in LDPC 3.0 ECC error correction engine, supporting both hard and soft decoding, with outstanding error correction capabilities.
Provide customized hardware instruction sets and firmware optimization, supporting machine learning and scenario optimization.
The modules have undergone rigorous ATE and system level testing to ensure reliability and compatibility.
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Mini eMMC
The innovative eMMC product with smaller size, reduced space occupation, and JEDEC pin definition retains all the performance of standard eMMC, and features high integration and ultimate lightweight.Adopting Mini packaging design, the volume is much smaller than standard eMMC modules, suitable for the needs of miniaturized embedded devices.
Supports HS400 high-speed mode, with read and write speeds consistent with standard eMMC 5.1 modules.
Optimized power consumption design, with standby current as low as 100 μ A, extending device battery life.
Supports BCH/LDPC error correction mode and high erase count.
Support on-site firmware updates for FFU to adapt to complex working environments.
The working temperature range is -40 ℃~85 ℃, which can adapt to harsh environments and has stability comparable to standard eMMC modules.