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Intelligent Innovation Boundless and Chip Towards the Future | Konsemi Invited to Attend the 2026 Semiconductor Industry Development Trend Conference and Deliver a keynote Speech
On April 10, 2026, Konsemi will attend the "2026 Semiconductor Industry Development Trend Conference" hosted by Huaqiang Electronic Network, and give keynote speeches at the IICIE International Integrated Circuit Innovation Expo, the "AI Empowered Consumer Electronics Innovation Application Forum" jointly hosted by Shenzhen Artificial Intelligence Industry Association and Huaqiang Electronic Network. Liang Huaihua, General Manager of the Market Planning Department, will share the opportunities and breakthroughs of domestic embedded storage under the AI wave.
Speech Summary
The global explosion of AI technology is profoundly restructuring the demand logic of the storage industry. The changing supply and demand pattern of the global storage market has driven the industry's prosperity to continue to rise - this is the golden window period for the domestic storage industry, and it is also a key opportunity for embedded storage enterprises to achieve technological breakthroughs and localization landing.
Liang Huaihua will combine Konsemi 's years of technological accumulation and rich industry practice in the field of embedded storage to deeply interpret the core changes in storage demand in the AI era, market opportunities for domestic storage, technological breakthrough paths, and localization landing strategies. Based on industry pain points and enterprise practices, it will provide practical and feasible references and inspirations for the development of the domestic embedded storage industry.
Date: April 10, 2026 (Friday)
Location: Intercontinental Hotel Shenzhen, Hall 2, Madrid
We sincerely invite industry colleagues to visit the site! Seize the dual opportunities of AI and domestic substitution with Konsemi , and jointly explore new blue oceans in the industry!
This conference is hosted by Huaqiang Electronic Network, with the theme of "Intelligent Innovation Boundless · Chip Towards the Future". It focuses on three core topics: digital empowerment, domestic substitution, and collaborative development. It shares practical solutions for the entire chain from design, manufacturing to procurement and distribution, explores technological integration paths and domestic substitution strategies, and aims to use digitalization to break through industry bottlenecks and work together towards a new journey of high-quality semiconductor development.
At that time, the conference will gather elites from the entire industry chain, including chip design, manufacturing, procurement, and distribution, and present awards such as "2025 (18th) Huaqiang Electronic Network High Quality Supplier and Excellent Domestic Brand" on site, setting an industry benchmark.
